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HOME > SERVICES > Thermal Resistance |
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SHIIMA delivers high quality data servicewhich measure thermal
characteristic and thermal
resistance of LSI
package.
Increasing needs for higher integration of
LSI, higher density of mounting technology
and higher frequency, it is important to grasp
the heat radiation characteristic correctly.
SHIIMA has more than ten years of experience in physical characteristic analysis of materials related to IC packages as the semiconductor related material supplier. |
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SHIIMA carries service at a low cost and short time for delivery. |
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SHIIMA guarantees holding a secret about all business. |
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If required, We are willing to submit NONE DISCLOSER AGREEMENT. |
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The measurement equipment is periodically calibrated. |
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-----<The yellow line shows the range.> |
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Temperature-sensitive parameter |
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- Ambient temperature setting range
::-40degreeC~+150degreeC |
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- Measurement current
:: 1mA~100mA |
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Thermal Resistance |
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- Environmental temperature
:: Normal temperature or 25+/-degreeC |
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- Still air:: Acrylics box using |
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- Moving air:: 0m/s~5m/s |
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- Measurement current
:: 1mA~100mA
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- Heating power:: ~100W |
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DUT: 4 points proving method |
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Mounting the package under test |
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Lead Frame PKG: more than 0. 5mm pitch |
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BGA/CSP: 0.5, 0.65, 0.75, 0.8, 1.0, 1.27mm pitch |
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* Please inquire us for other specification |
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