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| HOME > PRODUCTS MENU > Two Layer Copper Plating Polyimide Substrate |
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This product is copper build up on to die electric by plating.
Sumitomo Metal Mining Co., Ltd is manufacrturing with their originaly developed process from pretreatment to plating.
COF(Chip On Film) for LCD driver IC for notebook computers and LCD TVs etc. has reacently advanced higher density pattern due to trend of high performance and light weight, as to corresponding such reuirement, S'perflex has already become the industory standard . |
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Thin and uniform plated copper layer suitable for fine pattern |
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High electrical reliability generated by strong adhesion |
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Excellent bending durability resulted from special plating technology |
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High stability in dimension and higher IC bondability |
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Base FilmType |
KAPTON-EN series, UPILEX-S series |
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The Thickness of Base Film |
25,35,38,50µm |
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The Thickness of Copper Layer |
8µm as the standard, proposal could be accepted. |
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Typeof the Product |
one-sided or double-sided Copper |
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Shipping Shape |
in roll |
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Width, Length, Core Size,and with/without back supporting material can be requested. |
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