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(1) |
Solution Temperature and Concentration Control |
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Temperature Control in Tank: ±0.2°C is controlled to a preset value |
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Concentration Control Accuracy: ±0.1%(KOH ETMAH) is controlled to a preset |
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The System for Solution Supply at any concentration and blend ratio |
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(2) |
Original Conveying Technology for Wafer Carrier |
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Original Technology such as Wiperlike Conveyance (Ferris Wheel Type) |
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Automatic Machine with Space-saving Design |
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Available to various size from 4" to 8" |
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(3) |
High Temperature Circulation Filtering System |
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Available to High Temperature Circulation Filtering(about 160°C Max) for heat phosphoric acid and sulfuric acid/hydrogen peroxide mixture (SPM) |
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Superior to rivals in Space-saving, Low Cost, High Accuracy Temperature Controll(±0.5°C) |
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(4) |
Etching Uniformity |
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Wafer Suface Variance Control (within ±5%) at batch for different etching treatments (SiN Film, SiO2 Film, various Metal Film, and Si etc.) |
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Equipable with Monitors for detecting the Finish of Metal Film Etching Variance Control at Lot |
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(5) |
Others |
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Equipment Design subject to match research facilities |
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Equipable with Solution Supply/Waste Fluid Collection System (possible for Cost Reduction if introduced together) |
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