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| HOME > PRODUCTS MENU > High Thermal Conductive and Insulation Adhesive Paste |
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This adhesive paste is filled up with alumina filler, and excellent in high thermal conductivity and insulation. Especially, TCA4105's thermal conductivity is 4.0W/mk. By the screen printing, the adhesive strength can be enough with thickness of only 40um to 50um. Because the thickness of adhesive can be thinner compared to usual heat conduction sheet, thermal conductivity to a heat sink increases.
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High thermal conductivity. |
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Strong adhesive strength to the various kinds of organic and inorganic material. (Especially, aluminum heat sink. ) |
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Transforming into any shape and applying to any part of the material with the screen printing. |
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Designed to improve productivity and lower processing costs. (one liquid type) |
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Because the adhesive layer is thinner compared to film-typed adhesives, thermal conductivity is very good.
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Characteristic chart |
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parts number |
TCA4105(solvent type) |
TCA4210(non-solvent type) |
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Drying condition |
80°C 20min |
- |
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Curing condition |
140°C 30min |
140°C 30min |
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Thermal expansion coefficient |
28ppm |
30ppm |
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Insulation resistance value |
>10^13 Ω .cm |
>10^13 Ω .cm |
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Thermal conductivity |
4.0 W/mk |
2.3 W/mk |
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Adhesion strength |
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parts number |
TCA4105(solvent type) |
TCA4210(non-solvent type) |
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Aluminum(AL) |
25N/cm |
35N/cm |
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Copper(CU) |
10N/cm |
15N/cm |
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*The value in the table is typical one, and is not guaranteed. |
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