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	Functional Spherical Silica High Purity Synthesized Spherical Silica, having reactive radical on surface Two Layer Copper Plating Polyimide Substrate Polyimide Base. Two layer CCL High Flexibility Base Film Flex Solder Mask for COF High-Reliability Solder Mask for Next Generation COF (Chip on Film) Adhesive Paste This adhesive paste is one liquid type thermosetting adhesive having excellent screen printability,good adhesion with copper, aluminium, ceramics, non-organic materials, and organic materials such as glass epoxy substrate, Low Stress Adhesive Paste The adhesive is one liquid type thermosetting adhesive paste developed for IC package. Acid resistance Coating Resin The back side coating resin for TAB tape etching. Excellent in coating ability to coat all over without pin holes. High Thermal Conductive and Insulation Adhesive Paste The best use is for heat radiation materials and heat sink pasting. Laminator / Various Custom Made Machine This reel to reel copper lamination machine is for IC package substrate. It can be adopt multi-strand. Tray for Semiconductor and Substrate Protection against dust, static during transportation. High temperature resistance Precision Tools Precision parts for axial machine, radial machine Heat Spreader / Stiffener with Adhesive High performance Stamping Process Reel to Reel (Roll to Roll) Wet Process Equipment Custom Equipment for TAB/COF Manufactorer and R&D Institute Semiconductor MEMS LCD Manufacturing Equipme Custome Equipment for Semiconductor Manufacturer and R&D Institute