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Design Service |
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Printed circuit board design-Esurface mounting of PKG |
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Trial-Production Service |
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Trial-production of Functional material for electronic device |
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Semiconductor packaging Services |
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(Half day packaging service FBGA,TSOP,FlipChip,WLP,Ceramics PKG) |
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Advanced screen printing(Clean boose enviroment) |
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Surface mounting of PKG |
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Analysis Service |
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Cross section observation |
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Surface analysis/form observation(SEM.AFM) |
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Evaluation Service |
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Test and evaluation of material for electronic device |
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Thermal resistance test |
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Non-contact curvature measurement (based on shadow moiré technique) |
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Temperature (Thermal) cycle test |
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Environmental test(HAST,PCT,etc.) |
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