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SHIIMA delivers high quality data servicewhich measure thermal characteristic and thermal resistance of LSI package.
Increasing needs for higher integration of LSI, higher density of mounting technology and higher frequency, it is important to grasp the heat radiation characteristic correctly.
SHIIMA has more than ten years of experience in physical characteristic analysis of materials related to IC packages as the semiconductor related material supplier.
SHIIMA carries service at a low cost and short time for delivery.
SHIIMA guarantees holding a secret about all business.
If required, We are willing to submit NONE DISCLOSER AGREEMENT.
The measurement equipment is periodically calibrated.
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Temperature-sensitive parameter
- Ambient temperature setting range
::-40degreeC~+150degreeC
- Measurement current
:: 1mA~100mA
Thermal Resistance
- Environmental temperature
:: Normal temperature or 25+/-degreeC
- Still air:: Acrylics box using
- Moving air:: 0m/s~5m/s
- Measurement current
:: 1mA~100mA
- Heating power:: ~100W
DUT: 4 points proving method
Mounting the package under test
Lead Frame PKG: more than 0. 5mm pitch
BGA/CSP: 0.5, 0.65, 0.75, 0.8, 1.0, 1.27mm pitch
* Please inquire us for other specification